Прототип распределенной бортовой вычислительной системы
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Introduction |
4 |
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1. |
Analysis
of Requirements to Onboard Control Complex …... |
5 |
2. |
Block Structure and Content of Base Small SpaceCraft
(SSC) Complex……………………………………………… …. |
5 |
3. |
Contents
and Functions of Systems………………………….. |
6 |
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3.1. Power Supply System………………………………… ….. |
6 |
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3.2. SSC Control Unit…………………………………………… |
6 |
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3.3. Scientific Equipment Complex……………………………. |
8 |
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3.4. Thermal Control System…………………………………... |
8 |
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3.5. Communication System…………………………………… |
8 |
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3.6. Attitude Determination and Control System…..………… |
8 |
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3.7. Pyrotechnics and Separation Contacts System………… |
8 |
4. |
Definition of Architecture and Block Structure of
Onboard Computing System……………………………………………… |
9 |
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4.1. Electronic Boards………………………………………….. |
10 |
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4.2. Computing Module………………………………………… |
10 |
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4.3. Layout of Computing Module…………………………….. |
11 |
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4.4. Storage Devices Module………………………………….. |
12 |
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4.5. Interface Module…………………………………………… |
12 |
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4.6. Power Supply Module……………………………………... |
13 |
5. |
Operation Principles and Data Flows.………………………... |
13 |
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5.1. Optical Module of Hyper-Spectral System……………… |
13 |
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5.2. Computing Module………………………………………… |
14 |
6. |
Trunk Interface…………………………………………………... |
15 |
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6.1.Contents of Interface Technical
Facilities………………... |
15 |
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6.2. Information Exchange and Data Transfer
Control Pattern…………………………………………………………… |
16 |
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6.3. Transceiving of Data……………………………………… |
17 |
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6.4. Interlevel Exchange……………………………………….. |
18 |
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6.5. 8B/10B Coding…………………………………………….. |
18 |
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6.6. Receiving Side Decoding………………………………… |
18 |
7. |
Data link (DL) features…………………………………………. |
18 |
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7.1.
Rocket I/O Properties……………………………………… |
18 |
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7.2.
Architecture Survey………………………………………... |
19 |
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7.2.1. Inner Frequency
Synthesizer……………………… |
21 |
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7.2.2. Transmitter………………………………………….. |
21 |
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7.2.3. Output FIFO
buffer…………………………………. |
22 |
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7.2.4. Serializer…………………………………………….. |
22 |
8. |
Redundancy
Interface………………………………………….. |
23 |
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Conclusions……………………………………………………… |
24 |
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References………………………………………………………. |
24 |
Introduction
According to the project №2323 «The development of the prototype of
distributed fault tolerant on board computing system for satellite control
system and the complex of scientific equipment» of the International Scientific
and Technical Center the work on development of software and hardware parts of
mentioned prototype is carrying out in the Keldysh Institute of Applied
Mathematics of RAS and the Space Research Institute of RAS together with the
Fraunhofer institute Rechnerarchitektur und Softwaretechnik (FIRST, Berlin,
Germany) work on development of software and hardware for the above prototype.
The preprint describes the project’s hardware worked out by now.
The project envisages development of a fail-safe
distributed onboard computer system prototype to control a spacecraft and the
scientific equipment complex carrying out the hyper-spectral remote sensing of
the Earth.
The onboard control complex and scientific equipment control system
demand high rate of reliability and robustness against various factors.
Fulfillment of these requirements needs a variety of approaches to resolve the
instrumental implementation.
The preprint describes several units of the on-Board Computing System
(BCS) prototype resistant to some separate failures.
The BCS should be a distributed multi-computer system accomplishing
entire steering, telemetry and monitoring functions as well as all application
functions typical for scientific equipment and computer controlled complex.
Amalgamation of different computing functions on a spacecraft board into a single
system with a high redundancy rate allows both tight interworking between
various processes and optimizes flexible utilization of the reserved computer
resources to execute different tasks depending on the operation requirements
and the necessary failure resistance level.
The BCS architecture corresponds to a homogeneous symmetrical
multi-computer system i.e. it comprises several (from 3 to 16) similar nodal
computers interconnected by redundant data-links. The computer modules are
instrumentally identical and differ only by functions fulfilled. For the
redundancy sake one and the same function could be fulfilled by at least two
modules.
1. Analysis of requirements
to onboard control complex
The developed onboard complex is devised to control Small SpaceCraft
(SSC) conducting scientific and technological experiments at the near-Earth
orbits and the hyper-spectral Earth monitoring in particular. Analysis of the
necessary structure and composition of the base SSC have been made to deduce
preliminary specifications for the onboard control complex and its
modules/units.
2. Block Structure and
Content of the Base SSC Complex
The complex provides for control and survivability of SSC during its
boost to orbit and through the life time of the regular SSC systems and the
Scientific Equipment (SE). Along with this the complex together with sensors
and actuators of SSC must accomplish the following tasks:
● power supply system control
● spatial orientation monitoring
● spatial orientation regulation
● heat setting
● execution of systems’ initialization profile and failure cases
reconciliation.
● SSC operation profile maintenance during its regular orbiting
● maintenance of SSC control option to be commanded via a radio
link with the ground based complexes.
● accumulation and sending of service data via telemetry channels
● accumulation and sending of scientific data via telemetry
channels
Figure 1 gives a base composition of the complex. The given
abbreviations are expanded below in description of separate units.
Fig.1. SSC base equipment complex
3. Contents and Functions of
Systems
The Power Supply System (PSS)
distributes and provides feeding voltages to SSC consumers including SE. PSS
controls operation and charging conditions of accumulator batteries (AB),
switches currents between solar panels and AB’s depending on the illuminated
and shadowed orbit sectors. All functionally complete SSC devices should have
their own autonomous secondary power supply sources (SPSS) with galvanic
isolation from the mains. A special PSS setup protects a separate consumer in
case its output circuit is short (SC). The PSS should also control system’s
operational integrity and switch the redundant units (if any available).
A control unit (CU) relay should
be envisaged, if redundant SSC CU’s are engaged, for failure emergency cases.
SSC CU should provide:
●operation and interaction algorithm during the regular
space-borne life time of SSC
●program and data store access control logic
●program and data store majorization
●board timer-calendar schedule
●sensors and actuators data exchange interface
●accumulation of telemetry data, service and scientific
information
Programs and tasks are executed under control of a real time operation
system. The operation system monitors execution of the tasks and reconciles
conflicts emerging on faults.
List of the executed tasks:
●initialization and test of
SSC system
●execution of the assigned
orbiting profile
●operability control of SSC
systems
●operation control of
scientific equipment
●reception of control
commands from the ground based control stations
●picking up and transmission
of telemetry information
●SSC orientation control
●SSC heat setting
The information exchange data link protocol for SSC should have fault
recovery algorithms.
The CU should provide data link information exchange, process the
received from the Earth information, and compile SSC control profiles.
Integrity of the data exchange via actual communication channel requires the CU
to also prepare and code the data.
Scientific Equipment Complex (SEC) should correspond to tasks and
purposes of scientific experiment. The SEC should be implemented according to
requirements agreed with the SSC engineers at the draft project stage.
Thermal Control System comprises thermal sensors and heating elements
placed on the SSC body according to heat calculation. The system controls the
thermal condition of SSC operation.
The system provides uplink for
control telecommands and downlink for service and scientific telemetry data of
SSC.
Attitude Determination and Control System consists of:
● two triaxial angular
velocity sensors (AVS)
● two solar sensors (SS) to
determine the Sun position coordinates
● attitude control
thrusters.
The system is designated to keep up the SSC axial stability and sunward
orientation according to the measurement data received from SS and AVS.
3.7. Pyrotechnics and
Separation Contacts System
Pyrotechnics and Separation Contacts System consists of:
● contact or magnetic
relative position sensors of SSC mechanic units
● squibs, pyrobolts and
pyrovalves.
The system is intended to execute the stage separation when SSC is
boosted and deployment of the regular SSC systems when in orbit.
4. Definition of Architecture and Block
Structure
of Onboard Computing System
A possible scientific task for orbital remote sensing of the Earth by a
high resolution hyper-spectrometer [1, 2, 3] (hereinafter – instrument) was
chosen to analyze architecture requirements to the onboard computing system.
The hyper-spectral data source is supposed be a high resolution
(1280x1024) CCD matrix with the maximum frame rate of up to 450Hz. The
hyper-spectral data is stored in hard disks with ATA3 interface. An embedded
computer of PC/104+ standard, linked up to the mezzanine connector of Board A,
is used for system debugging and service computer interface via Ethernet 10/100
protocol.
The hyper-spectral complex electronic part comprises the following
modules:
- computing module;
- storage modules;
- interface module;
- power supply module.
Interconnection
diagram of the complex modules is given in Figure 2.
Fig.2. Interconnection diagram of the complex modules
4.1. Electronic Boards
Guiding development principle for electronic modules was the boards’
versatility. This means that one and the same board may be used for different
applications. The entire complex involves only four types of specialized boards
as a result.
Board A is the basic board of the complex. The board has Virtex-II-Pro
PLM chip, DSP TMS320C6416, SDRAM 256 MB memory module, and connectors for mezzanine
modules (PC/104+ sockets) and for the backplane (Compact PCI slot).
Board B is an auxiliary board of the complex. The board has connectors
for linking with Board A and other cables.
Board C is the backplane for boards A of the computing module. The board
has interface connectors for Boards A and power supply cables.
Board D is the key board of the hyper-spectral system’s optical part.
The board has LUPA-1300 CCD matrix, fast ADCs, buffer amplifiers as well as
interface connectors with Board A and other cables.
4.2. Computing Module
Analysis of requirements stated for the system showed that conventional
PCI and Compact PCI buses do not provide for necessary throughput. Moreover,
use of the mentioned standards compels either to limit the boards’ number or
apply bridge connectors what would tell upon the bus’s throughput for boards
interworking via the bridge. Besides, the «multidrop» architecture implemented
in the above buses is seen to be less suitable because of its high complexity
and low scalability.
A “point-to-point” architecture was suggested to surmount the noted
limitations. This means that communication is set between two terminal devices.
4.3. Layout of Computing
Module
The Computing Module is implemented in Compact PCI 3U format. This
format was chosen due to the following reasons:
- the Computing Module’s housing complies with “Euromechanics” standard
allowing its assembly from relatively inexpensive widely used parts;
- the involved high density connectors have low inductance and acceptable
impedance for use in high-speed data-links;
- large quantity of connectors’ “ground” pins provides for steady
digital “ground” even under high external interference;
- a rear-pin option (bypass connectors) allow connection of auxiliary
boards to the rear side connectors, see Fig.3 and Fig.4.
Fig.3. Auxiliary boards connection scheme.
Complete set of computing module
Fig.4. Main and auxiliary boards
connection diagram
The Computing Module is completed with Boards A and Boards B. Number of
Boards A depends on the computing power needed, and number of Boards B depends
on – the connected devices quantity. Besides, the Computing Module includes a
PC/104+ standard computer serving control and debugging of the system as well
as communication with other complex systems via Ethernet 10/100 protocol.
4.4. Storage Devices Module
The Storage Devices Module comprises rack-mounted magnetic storage
devices of the “hard-disk” type. This type of build-up allows installation of
the required array of hard-disks. Besides, the disks are either easily
dismounted or replaced. The rack containers are supplied with a fan and
temperature monitor to avoid overheating.
4.5. Interface Module
The Interface Module (used for debugging) consists of a sensor panel
TFT-display connected to computer mounted on the computing module control
board. The Interface Module provides for runtime monitoring and can either be
used for debugging and setting up of the soft- and hard-ware means of the
complex.
4.6. Power Supply Module
The Power Supply Module converts the input voltage to operating voltages
of the complex: +5V and +12V. Other voltages consumed by different complex
components are formed directly at the place of use. The Power Supply Module’s
boards have high stability converters and the boards are amalgamated in the way
making it possible to scale the total power capacity as a function of the load
needed.
5. Operation principle and
data flows
First let us consider the hyper-spectral complex operation principles in
terms of the optical module electronic part. The computing module details are
discussed further on.
5.1. Optical Module of
Hyper-Spectral System
The hyper-spectral system’s optical module comprises four Boards D with
a Board A attached to each one.
The module’s optical elements frame an image on the CCD matrix surface
where it is fixed and transferred to Board A at the board’s request control
signals. Then the image is passed over to the computing module via the dual
Rocket I/O line.
Each CCD matrix has the resolution of 1280×1024 with the dynamic
range of 1000 (10 bits) and provides shooting with the frame rate of 450 fps.
Therefore, one Board B receives not more than:
1280×1024 (resolution)
× 10 (dynamic range, bit)
× 450 (maximum frames per second)
= 5.6 Gb/s.
Such data stream is input to Board A. The Board A converts the data to
serial code and transfers it to a computing module via the Rocket I/O dual
lines. One Rocket I/O line has the throughput of 0.65 up to 3.125 GB/s so the
full scale operation does not require any data compression what lowers the
computing module’s load. Nevertheless some small preprocessing or data
compression should rather be made to escape operation at the throughput limit.
5.2. Computing Module
The Computing Module consists of not more then 9 Boards A while each of
them is capable of connecting with Board B. Besides, a PC104+ form factor
computer or an extra mezzanine computer (not described in the preprint) is
mountable to the Board’s A mezzanine connector.
The computing module’s Board C (backplane), carrying 6 Rocket I/O lines
as shown in Fig.5, is connected to Board A from one side. This allows
communication with adjacent boards via fast serial links. From the other side
the board is connected to Board B providing Board A with an interface to
external devices.
If any two Boards A fail the module would still be operable. The Boards’
A interwork would detour the malfunctioning boards.
Рис.5. Boards A communication
diagram
The Computing Module’s Boards A serve different functions depending on
their assignment. The main functions with descriptions of their work and data
streams are discussed below.
Computing Module’s Boards A compose three units:
- data acquisition unit,
- data processing unit
- control and exchange unit.
The Boards A composing the data acquisition unit are connected to the
optical module via Boards B and Rocket I/O lines. Main function of these boards
is accumulation, buffering and transfer of data to the data processing unit.
Apart from, the boards transfer data to the storage module generating commands
for writing data to hard drives.
The Boards A composing the data processing unit handle data by working
algorithms to pass the results over to control and exchange unit.
The Boards A composing control and exchange unit interact with PC/104
computer providing reception of commands and data transfer from other systems
of the complex.
6. Trunk
Interface
Trunk
interface with decentralized control used in the electronic modules system
provides for to the following requirements:
Adopted
abbreviations:
DL
– data links
GCB
- General Communication Bus
Aurora
[4]– soft-and-hardware interface
Rocket
I/O [5] – transceiver standard
6.1.
Contents of Interface Technical Facilities
The
interface technical facilities include:
-
processor modules;
-
backplane;
-
I/O modules.
Number of different or similar processor
modules is up to 10
Backplane is single.
Number of I/O modules is up to 10.
Processor
modules are connected to the backplane and have no other external connections.
I/O modules are connected to the backplane and have connectors for external
devices. Quantity and buses of external devices depend on the concrete task.
The processor modules and I/O modules connection to the back-plane diagram are
given in Fig.3.
6.2.
Information Exchange and Data Transfer Control Pattern
The
information exchange is made according to Aurora protocol [4]. Aurora – is an
easy scaleable logical multilevel protocol. It is designed to arrange a data
link via one or several physical lines between two nodes. The Aurora protocol
does not depend on the chosen low level protocol. This could be either
Ethernet, Rocket I/O, et al. The protocol’s physical level isolation benefits a
designer with independence on the low level protocols development. The Aurora
protocol is an open one and is fully available for user supplements and
changes.
Here the data transfer process via the Aurora channels is described. An
Aurora channel may comprise several Aurora lanes. Each lane – is a
bidirectional channel for serial data transfer (DT). The communicating devices
are called Aurora partners. Fig. 6 depicts the interwork.
Fig.6. Avrora channel overview
The Aurora interface passes the information through user applications.
So the data transfer has two link types:
- between Aurora interfaces;
- between user application and Aurora interface.
In the first case data stream consists of User Protocol Data Units (PDU),
and in the second one it consists of Channel Protocol Data Units. The units may
be of any length as defined at higher level.
There are five data types passed over the Aurora channel. The types are
specified in the waiting priority order – from higher to lower one:
a. Frequency compensation series. These are sets of control symbols
equalizing the node transmitters’ frequencies.
b. Interface module’s control symbols.
c. User application’s control symbols.
d. Data units.
e. Control symbols generated in the standby mode.
Transfer of user PDUs requires the following operations:
a.
Padding
b.
Adding of control separator symbols
at the units’ bounds.
c.
Special 8B/10B PDU coding
d.
Conversion to serial type and coding
of frequency.
User PDU consists of smaller information units - octets.
Padding. If unit has an odd octet
number the unit is ended with an additional octet of 0x9C.
On entering the lower level a Channel PDU is assembled. The control data
is added to information data. Control symbols named “ordered sets” are
supplemented to the beginning and the end of the Channel PDU. The starting
control packet is called /SCP/ (/K28.2/K27.7/). The ending packet is called
/ECP/(/K29.7/K30.7/).
Before data is passed over to physical level the 8B/10B coding is made.
This is carried out at the special Physical Coding Sublayer (PCS). The coding
is - conversion of all octets, except for the padding ones, to symbols. This is
necessary to improve the detection efficiency at the other line end.
After coding the data sequence is transmitted to line. Data are
transmitted in “Non Return to Zero” format - NRZ. In other words the data
series have approximately equal quantity of ones and zeroes.
The user PDU decoding is carried out as follows:
a. Conversion to parallel type from serial one.
b. 8B/10B decoding.
c. Extraction of control symbols on transition from lower levels to higher
ones.
d. Extraction of the padding symbols.
7. Data Link
(DL) Features
The interface physical level is implemented in
Rocket I/O standard [5]
a)
Full-duplex transceiver operates at
various rates (500 Mb/s – 3.125 Gb/s). Maximum line length is 20 inches (50cm).
b)
Monolithic clock synthesis system
and the received signal frequency recovery system with minimum number of
external electronic components. This property is especially essential when high
frequency data links are used since the received frequency may slightly deviate
from the transmitter’s clock reference frequency. Special buffers are designed
to compensate this discrepancy.
c)
Programmable voltage bias at
differential lines of Rocket I/O. There are 5 voltage bias levels possible to
smoothly be set from 800mV up to 1600mV. The bias polarity is also
programmable.
d)
Programmable special pre-emphasis
level for better electrical parameters of communication quality. Pre-emphasis
should be deemed as deliberate alteration of the transmitted signal’s shape.
When the technique is used the received signal is better identified rather then
without the pre-emphasis. Five pre-emphasis levels can be set up.
e)
Direct current isolation capability.
Necessity in it emerges when there is no DC interfacing between receiver and
transmitter.
f)
Programmable on-chip adapting of 50
and 75 Ohm with no external elements involved.
g)
Programmed serial and parallel
coupling of transmitter and receiver to test their integrity.
h)
Programmed mode of the
separator-symbols detection (comma detection) and other checks of the input
signal (8B/10B) integrity.
Rocket I/O transceivers are based on MindSpeed’s SkyRail technology.
Table 2-1 shows numbers of Rocket I/O transmitters in different types of FPGA
packages of Xilinx.
The system can work in the serial data transmitting mode at any baud
rate within the range of 500Mb/s – 3.125Mb/s. The data transmission rate may
not be preset as it could be clocked by received signal. Data is transferred
via one, two or four Rocket I/O channels. Different protocols are possible for
the Rocket I/O data transmission.
There two ways for selection of the data transfer protocol
a.
Changing of static attributes in the
HDL code.
b.
Dynamic changing of the attributes
through protocol ports.
Rocket I/O transceiver consists of two part-sides:
a.
Side for connection of physical data
link lines (on the left of Fig. 7)
b.
Program code side (on the right)
Fig.7. Rocket I/O transceiver block diagram
The left side comprises Serializer/deserializer (SERDES), TX and RX buffers,
reference clock frequency generator, and the input signal frequency recovery
circuit.
The right side contains the 8B/10B codec, resizable buffer for the phase
shift recovery and combining of signals when transmission uses 2 and 4
channels. The carrier frequency is higher than the reference clock frequency at
the REFCLK pin 20 times.
The input signal carrier frequency is measured by the Clock/data
recovery system (CRS). This circuit an on-chip phase-stable oscillator with no
external elements involved. The CRS recovers either the input signal frequency
or its phase. The obtained frequency is divided by 20 and written to RXRECCLK
register.
The REFCLK, RXRECCLK values have no phase locking neither between
themselves or other frequencies, if not otherwise specified. If data is
received over one- or four-byte channel RXUSRCLK and RXUSRCLK2 have different
frequencies (1:2). The lower frequency leading edge is locked to the higher
frequency trailing edge. This is either valid for TXUSRCLK and TXUSRCLK2.
The CDR system is automatically locked to REFCLK, should no input signal
occur. Correct performance demands that deviation between REFCLK, TXUSRCLK,
RXUSRCLK and RXRECCLK frequencies be not greater then 100 ppm. To comply
with the requirement it is necessary to take steps to suppress the power supply
noise and eliminate the signal lines’ interference with regards to the ground
and each other.
FPGA may transfer 1,2 or 4 symbols. Each symbol can have 8 or 10 bits.
If an 8-bit signal is used then the rest additional signals are engaged in 8В/10В codec control. But if the
codec is off, i.e. a signal passes it by, then 10 bits of the mentioned signal
are transferred in the following sequence:
TXCHARDISPMODE[0]
TXCHARDISPVAL[0]
TXDATA[7:0]
Now some more detail about the 8В/10В codec
The codec uses 256 similar data symbols and 12 control symbols, used for
protocols of Gigabit Ethernet, XAUI, Fiber Channel, InfiniBand. The codec is
input with 8 data bits and one special bit – “K”-symbol. On the one hand the
codec checks the data transfer validity and sets up the so called serial line
DC-balance on the other hand. The system may be excluded from the data transfer
path.
Transceiver has the parity check system. Both this system and the 8B/10B
system directly deal with TXCHARDISPMODE and TXCHARDISPVAL signals.
The device normal functioning is only possible when FPGA reference
frequency (TXUSRCLK) is locked to REFCLK. Only one cycle phase shift is
permitted. The FIFO has a depth of four. Error signal is generated if the buffer
is overflowed or underflowed.
The transceiver converts parallel data into serial one, while the lower
bit is transferred first. The carrier frequency is – the REFCLK multiplied by
20. The TXP and TXN electrical polarity can be preset in TXPOLARITY port. This
is necessary when the differential signals had been swapped over at one board.
8.
Redundancy interface
The key point of the computing system hardware part development is the
choice of a general bus. This bus was chosen to be the General Interconnect Bus
(GIB) Ver.1.02, allowing redundancy. The bus is physically implemented with
Z-PACK connectors with feedthrough junctions (connection of the rear-pin type).
The bus carries out two functions.
a) The bus is designated to interconnect the main boards plugged to the
backplane. Fig. 6 gives an example of six transceivers involved. The figure
demonstrates that one board’s failure does not effect availability of the
others.
b) The bus must provide exchange between main Board A and the auxiliary
Board B witch are connected to the backplane C.
It should be pointed out that if 12 Rocket I/O transceivers are
used the redundancy problem is obviously solved. The regular operation mode
involves 6 transceivers while other 6 are reserved. Thus the twofold data link
redundancy is provided.
Fig.8. Diagram of interconnection between basic A
boards
Note that such an interconnection preserves the communication integrity
for any two boards even in case of failure of two neighboring boards between
them (Fig.8).
Conclusions
The preprint presents the hardware part of developed
results of the project creating the fail-safe BCS to control both spacecraft
and scientific equipment complex. Requirements to the BCS hardware part are
defined. The structure scheme and contents of the base SSC complex are
substantiated. The BCS architecture and the schematic diagram are defined. The
hyperspectral system operation principle is considered. Description of the BCS
boards’ trunk interface and the data-link characteristics is given. The BCS’s
backplane board build-up principle providing relay from any malfunction board
is described.
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